semiconductor news 2020

The emarging non-volatile memories market is expected to grow at >50% compound annual growth rate – mainly driven by the demand for embedded magnetic random access memory (MRAM) and standalone phase change memory (PCM). 2020-07-22 2020年度第2四半期決算 カンファレンスコールのお知らせ ビジネス 2020-07-21 SiCパワーモジュールの新製品がデルタ社で採用 製品 2020-07-13 オン・セミコンダクター、年次 CSR レポートを発行 ビジネス 2020-07-08 The spectroscopic characterization tools in this lab will allow us to look at crucial EUV-photon reactions with resists at attosecond timeframes, which are also relevant to understand and mitigate stochastic defect formation. Besides exploring EUV lithography for patterning critical DRAM structures, imec provides the building blocks for true 3D DRAM solutions. In the future, we expect to see many more of these heterogeneous SoCs – as an attractive way to improve system performance.In order to connect the technology options to the performance at system level, we have set up a framework called S-EAT (System benchmarking for Enablement of Advanced Technologies). The report helps you find the hidden opportunities from the data available after the comprehensive research. The report studies the competitive landscape of the global Semiconductor Chips market, presenting insights into the company profiles, financial status, recent developments, mergers and acquisitions, and the SWOT analysis. Imec’s goal is to demonstrate efficiencies for inference in the order of 10,000 Tops/W.We are pursuing a different approach by looking at analog compute-in-memory architectures. It may be more advantageous to use different process technologies for different sub-systems to optimize design costs and yield. How do you ensure cache coherency with multiple CPU cores accessing a shared cache? This framework allows us to evaluate the impact of specific technology choices on the system level performance. The USMCA is the first U.S. agreement to incorporate several top U.S. semiconductor industry priorities, […]Bipartisan legislation would advance domestic production and research of chips critical to America’s economy and national security WASHINGTON—June 25, 2020—The Semiconductor Industry Association (SIA) today applauded introduction in the Senate of the American Foundries Act of 2020, legislation that would provide federal investments totaling tens of billions of dollars for semiconductor manufacturing and research to […]WASHINGTON—June 23, 2020—The Semiconductor Industry Association (SIA) today released the following statement from President & CEO John Neuffer in response to President Trump’s recent immigration executive order. And this is where low temperature IGZO (or indium-gallium-zinc-oxide) family of transistors enter the scene. A promising 2D-based device architecture involves multiple stacked sheets each surrounded by a gate stack and contacted from the side. SEOUL, South Korea and SAN JOSE, Calif., July 30, 2020 /PRNewswire/ -- MagnaChip Semiconductor Corporation today announced financial results for the second quarter of 2020. Direct bonding of die to silicon is also possible using hybrid Cu bonding. By defining the n-to-p space with a dielectric wall, the track height can be further scaled.Another standard cell architecture evolution that will help with routing efficiency is a vertical-horizontal-vertical (VHV) design for metal lines, as opposed to traditional HVH designs. SIA, in partnership with Salesforce, hosted a webinar on May 27 to discuss these challenges and how to […]1101 K Street NW Suite 450, Washington, DC 20005 The report shares information associated with aspects such as definitions, classifications, applications, and market overview, product specifications, manufacturing processes, and cost structures.

WSTS expects the world semiconductor market to be up by 3.3 percent to US$ 426 billion in 2020. This server decides what data will be sent to the cloud server (typically, data needed for less time-sensitive tasks, such as re-training) and what data gets processed on the edge server.Compared to cloud-based AI, in which data needs to move back and forth from the endpoints to the cloud server, edge AI addresses privacy concerns more easily.

We expect semi-damascene metallization modules to simultaneously improve resistance and capacitance in the tightest pitch metal layers.Semi-damascene will allow us to increase the aspect ratio of the metal lines (to lower resistance) by direct patterning and use airgaps as a dielectric in between the lines (to control the capacitance increase). What are the bottlenecks that limit speed, and how can we improve the bandwidth and data protocols that are used to fetch the data?Imec deploys its system-level simulator platform S-EAT to gain insights into these bottlenecks. We try to understand, detect and mitigate stochastic failures and could recently report an order of magnitude improvement in stochastic defectivity.To accelerate the introduction of high-NA EUV, we are installing Attolab – allowing to test some of the critical materials for high-NA EUV (such as mask absorber layers and resists) before the high-NA tool will be available.

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